HiRes™ series is sold in both n-type and p-type versions. The resistivity starts at 8,000 ohm-cm, and is characterized by good resistivity control.

HiRes™ is available in diameters up to 150 mm. HiRes™ silicon is targeted towards RF/wireless applications. The combination of superior microwave performance with state-of-the-art polished wafers will enable integration of many functionalities on a single chip. This includes power handling devices working with MEMS devices and lots of other combinations.

Product Specifications: HiRes™

In terms of cost, the HiRes™ product are very attractive compared to standard solutions such as SOI wafers, compound semiconductor wafers and other microwave substrates.