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The fracture strength of nitrogen doped silicon wafers

Abstract
With a specially designed double ring bending setup, we have studied the room temperature fracture strength of silicon wafers prepared by standard manufacturing methods with both (as) cut, (as) lapped, and (as) polished surfaces. Wafers from six different crystals have been tested.

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High Resistivity NTD – Production and Applications

Abstract
Neutron Transmutation Doping (NTD) of silicon has been in use for 25 years. The process is based on irradiation of Si with neutrons.

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