Of the two processes, the float zone method (FZ) is by far the most precise and purest production method. Hence, components produced with FZ silicon wafers are used for special purposes for which the purity of the silicon in the wafers is essential to the function of the components, for example in high and medium power components.
The Czochralski method (CZ) is a less pure and less expensive method for wafer production, and silicon wafers produced by this method are used in various types of low and medium power components. CZ silicon is easier to produce with large diameters, and as for many applications, the critical factor is not the purity of the silicon but the surface area of the wafer to allow as many units as possible to be produced from a single wafers, the CZ production method is the most common production method.
Topsil’s FZ wafers are manufacted in Frederikssund, whereas the production of CZ wafers takes place in Warsaw.
