Topsil MEMS wafers are characterised by large flexibility in terms of bulk properties and wafering. The MEMS silicon wafers have excellent resistivity tolerances and very low leves of performance degrading impurities.
Topsil MEMS silicon is available as float zone or Czochralski wafers in diameters up to 150mm. MEMS wafers based on float zone material have no oxygen in the bulk which make them an excellent choice for power MEMS components, high efficiency microstructured solar cells, photodiodes, and RF MEMS devices. MEMS wafers based on Czochralski material are particularly suitable for high volume components such as MEMS accelerometers and MEMS microphones.