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Product Category

Surface Finish

Majority Carrier Type

Wafer Diameter

Crystal Orientation

Wafer Misorientation

Resistivity (min-max) in Ωcm

Thickness (+/-) in microns

Flat

Edge Rounding

Notch

Application

Maximum TTV allowed (in microns)

Maximum Warp allowed (in microns)

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20/12/2024

22/08/2024

22/08/2024

17/11/2023

12/10/2023

10/10/2023

Topsil GlobalWafers A/S – CVR: 37842222 – Siliciumvej 1, DK-3600 Frederikssund – Phone: +45 47 36 56 00